• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A power electronics device, such as a frequency converter, which comprises power modules (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) and a substrate power (41, 51), which power substrate (41, 51) comprises an elongated power supply circuit (UDC, DC +, DC-) arranged in the longitudinal direction of the power substrate, as well as first and second cooling channels elongated liquid (45, 46, 53) arranged in the longitudinal direction of the power substrate, and which power modules (30, REC1, REC2, CDC1, CDC2, CDC5, IN1, INU21, INU22, INU51, INU52) can be installed on the power substrate, characterized in that the power substrate (41, 51) is formed to be an elongated profile, the profile comprising a base portion (48, 58) and side walls (49, 59), that form a space that is open on one side, and in which at least two substra t for power modules are arranged in the longitudinal direction of the power substrate (41, 51), which substrate locations are arranged at standardized distances (d4) from each other, such that each location has mechanical interfaces (42, 55) substantially similar to the power substrate, electrical interfaces (44, 54) substantially similar to the power substrate supply circuit, and liquid cooling connections (43, 52) substantially similar to the power supply channels. liquid cooling of the power substrate.
    公开号:FR3027483A3
    申请号:FR1559735
    申请日:2015-10-13
    公开日:2016-04-22
    发明作者:Osmo Miettinen；Jukka Jaskari；Stephan Strandberg
    申请人:Vacon Oy；
    IPC主号:
    专利说明:

    [0001] The invention is a structural arrangement for a power electronics device. More particularly, the object of the invention is a structural arrangement in which a number of sub-modules of a liquid-cooled frequency converter can be connected to a common power substrate. PRIOR ART AND DESCRIPTION OF THE PROBLEM The general trend concerning the development of power electronics devices, for example frequency converters, is to increase the power density. It is known in the field that to pass a high power in a device of reduced size, it is necessary to effectively cool the components that pass this power, the best method for this is the liquid cooling, that is to say say the transfer of the dissipated power produced in the components by means of a liquid flowing in the device to the outside of the device. In general, for economic reasons, liquid cooling is used only with devices of high rated power, for example frequency converters of more than 100 kW. Since the individual performances of the power semiconductor components are limited, at high power these have to be connected in parallel, whether a number of components are available in parallel in the same device, or that Complete devices are connected in parallel to feed the same load. Connecting components in parallel in the same device poses certain problems, in particular because in this case, one must build mechanically different structural units for devices of different nominal powers. In general, at the highest nominal powers, complete devices are connected in parallel, which reduces the need for separate structural units and therefore has an advantage in manufacturing and maintenance. However, a series of products that covers an extended power range usually requires a number of power modules of different power ratings and sizes. If they are installed, for example, in cabinets, there must be a large quantity of electrical and mechanical connection elements, liquid cooling accessories, and so on, corresponding, which are dimensioned for different nominal powers and classes of different size. SUMMARY OF THE INVENTION The object of the present invention is a new type of structural arrangement for a liquid-cooled power electronics device, more particularly a frequency converter. The disadvantages mentioned above can be avoided with this arrangement, this arrangement being adapted for use in the implementation of a series of products having an extended power range and an extended voltage range. The object of the invention is achieved with an arrangement characterized by what is set forth in the characterizing part of the independent claim. Other preferred embodiments of the invention constitute the objects of the dependent claims.
    [0002] In the structural arrangement according to the invention, a number of power modules belonging to an apparatus may be attached to a common metal power substrate, which includes interfaces for connecting the power modules with both a power circuit. common feed and a circulation of coolant. According to the essential principle characteristic of the invention, the substrate locations arranged for the power modules are located at standardized distances from each other, and each of the substrate locations has essentially similar mechanical, electrical and liquid connections for the modules of the power modules. power.
    [0003] The power substrate according to the invention is formed from an elongate profile, preferably U-shaped in its cross-section, the profile comprising a base portion and wall portions, projecting substantially vertically from the profile, said wall-forming portions forming a space that is open on one side. The power substrate can be made of eg aluminum, with an extrusion process, in which case the liquid channels forming the cooling circuit are formed from the extrusion phase to become a fixed part of the substrate structure. . The perforations of the substrate necessary for the connection of the power modules can be made, for example, by drilling. Power substrates of different lengths can be cut as needed from an extruded aluminum bar of great length. The power modules belonging to the system according to the invention, whatever the power class and the functionalities of the module, have identical mechanical dimensions and identical interfaces, said dimensions and interfaces being compatible with the locations on the substrate. If a power module is connected to a common supply circuit or a coolant circulation, the corresponding electrical and liquid connections are also identical, in which case any power module of the system can be set up at any location of the substrate. In the arrangement according to one embodiment of the invention, all the power modules belonging to the same power substrate, or only a part thereof, are connected so as to be connected in parallel to the same external load. It is also possible to provide an arrangement in which the power modules operating as a filter of a common supply circuit, for example an intermediate circuit CC of a frequency converter, are connected in parallel. Because of parallel branching, the power class of a device can be extended using similar elementary modules. From the point of view of ease of manufacture and maintenance, among others, this type of modular system is advantageous because of the small number of different power modules required.
    [0004] The arrangement in parallel connection according to the invention appears redundant in certain types of failure situations, for example when a detectable failure on a measurement circuit occurs in a power unit. The failed unit in question can, in this case, receive a command putting it out of service, in which case the units in good condition, connected in parallel to this faulty unit, can continue to operate. BRIEF DESCRIPTION OF THE DRAWINGS In the following, the invention is described in more detail with the aid of some examples of its embodiments, with reference to the accompanying drawings, in which Figure 1 shows the main circuit of a circuit. Fig. 2 shows a block diagram of a frequency converter control circuit. Fig. 3 shows the structure of a power module according to the invention. Fig. 4 shows the structure of the frequency converter control circuit. of the power substrate according to the invention, and Figure 5 shows the structure of a power electronics device according to the invention.
    [0005] DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows an example of the main circuit of what is called a two-level normal PWM frequency converter, in which a circuit forming a bridge for a three-phase network RECi, composed of diodes, rectifies the three-phase AC voltage of the supply network connected to the connectors L1, L2, L3 to make it the DC voltage of the intermediate circuit, which voltage DC has the poles DC +, DC- and is filtered by a filter capacitor unit Cpci functioning as energy storage device. An inverter bridge INUi, consisting of three phase switches made with the semiconductor power components V1 ... V6, D1 ... D6, forms, from the DC voltage of the intermediate circuit, the three-phase output voltage U , V, W for controlling the motor M1. A phase switch designates the components connected to the same output phase, which components can connect the output phase to any pole of the intermediate circuit, e.g. with respect to the phase U, the controllable power semiconductor components V1, V4, and the diodes D1, D4 mounted in parallel therewith. In modern frequency converters, the power semiconductor components V1 ... V6 which control the phase switches are most often IGBT transistors according to the embodiment of the figure, in parallel of which are connected what the Diodes of clamping Di ... D6 are called. The control unit CUi controls the operation of the device. An inductive component is normally connected to each side of the network bridge to filter the harmonics of the network current taken by the frequency converter, but it is not shown in the figure because it does not have any particular importance for regard to the present invention. Figure 2 shows a single-line diagram of a known method for implementing a high-power frequency converter, wherein the power level requires a parallel connection of several power modules. In the figure, the choke coil assembly LAci filtering the supply network current, the rectifier assembly REC2 and the capacitive assembly Cpc2 operating as an energy storage device of the intermediate circuit are common to the two inverter assemblies. INU21, INU22, the output phases of these inverters are interconnected via the LAC21, LAC22 choke coil assemblies, a principle presented, for example, by US Pat. No. 6,985,371, for supply a M22 common-load motor. Figure 3 shows the structure of a power module 30 according to the invention, seen both from the front (left side of the figure) and from the side (right side of the figure). The power module 30 is disposed in an enclosure 31 made of an electrically insulating material, the shape of the enclosure being designed such that the connectors of a first electrical circuit, e.g. a common DC intermediate circuit containing the DC + and DC- poles of all the power modules of the frequency converter, are located on its base portion 33. According to the invention, these interfaces are of a type such as an electrical interface Reliable with the first electrical circuit is formed when a power module is inserted to put it in place. The details of the connector are not shown in the figure but, for example, what is known as a blade connector, known to those skilled in the art, satisfies this requirement. If a module is of a type also having interfaces with another electrical circuit - eg, in the case of an INU, with a motor circuit 20 - these connections U, V, W can, depending on the invention, preferably be arranged on the opposite side of the power module, in the cover portion 36 of the module. When a power module has interfaces 34 for the circulation of the liquid which cools it, according to the invention these interfaces are arranged and arranged in such a way that a reliable anti-leakage liquid seal is formed between the power module. and the power substrate at the moment of pressing a power module to put it in place. The details of the interface are not shown in the figure, but the objective can be achieved for example by a sealing structure, eg a rubber seal, surrounding the opening. For attaching a power module to its position, the power module may be provided with connector flanges 35 and, through the openings in these flanges, the module may be attached to the power substrate, e.g. ., with a conventional screw joint. FIG. 4 shows an embodiment of the structure of a power substrate according to the present invention, seen from above, that is to say from the direction from which the power modules are driven to be put in place (left side of the figure), and in cross section from the side (right side of the figure). The metal frame 41 of the power substrate is formed from a profile, which preferably has a substantially U-shaped cross-section. The profile comprises a base portion 48 and wall portions 49, projecting substantially vertically from the base, said wall-forming portions forming a space which is open on a wall. The power substrate comprises two hollow channels 45, 46 for the circulation of coolant, which channels are formed within the profile formed by the base portion 48 and the wall portions 49 projecting therefrom. Apertures 43 are arranged in the channels at regular intervals d4, through which openings the coolant is able to flow through a power module disposed on the substrate from one channel to the other. DC +, DC- busbars belonging to a power supply circuit, for example, the DC circuit of a frequency converter, said circuit connecting the power modules, are fixed to the power substrate. For clarity in the figure, the arrangements for fixing the busbars and busbar isolation arrangements are not shown here. The connectors 44 are fixed to busbars at regular intervals d4 for connections to the power modules. The connectors are preferably of a type such that an electrical connection is formed when a power module is depressed to put it in place, for example, according to the figure, so that the connectors 44 of the busbars have protrusions perpendicular to the rails, the projections being driven to come inside the homologous connectors of the power module.
    [0006] Fixing holes 42 are arranged at regular intervals d4 in the edge portion of the power substrate for the mechanical fixing of a power module. The space 47 required by a power module is marked in the figure with a broken line. According to the invention, essentially similar connections 42, 43, 44 for the power modules are arranged in the power substrate at standardized intervals d4; and in this case, the power modules can be arranged on the substrate at standardized intervals d4. Since the connections are substantially similar, any power module can be disposed at any location on the substrate. Figure 5 shows a perspective drawing of the placement of the power modules on the substrate 51, which is formed from a profile, which includes a base portion 58 and wall portions 59 projecting substantially vertically from the substrate. The locations of the power modules (in the embodiment of the figure, an empty location PM5 as well as locations in which are arranged the power modules INU51, IN U52 and CDc5) are arranged in the power substrate 51 in the direction longitudinal (the longitudinal direction is marked by an arrow in Figure 5). The power modules may be of different types and may include only some of the power substrate connections, but may be freely available at any location on the substrate. For example, the filter unit CDC5 comprises interfaces only for the common supply circuit DC +, DC- (54) and for the power substrate (55), but no output interfaces U, V, W, or interfaces for liquid cooling (52, 53) such as INU51, INU52 inverting assemblies. When a power module does not include an interface for liquid cooling, it has a sealing surface, which prevents leakage of liquid, eg, a closed rubber-type surface, to be placed at the openings 52 for liquids. In a manner obvious to those skilled in the art, the invention and its various embodiments are not limited exclusively to the examples described above, since it is possible to apply to them variants within the scope of the claims presented below. . In the description of the invention, a two-level PWM frequency converter and some of the associated power module types have been used as examples. This does not mean, however, that there are restrictions as to the application of the invention, but instead indicates that the invention can be applied to other types of power electronics devices, e.g. so-called three-level NPC frequency converters, in which the DC intermediate circuit comprises three poles, and to other types of power modules which may comprise, for example, filter components belonging to the network interface.30
    权利要求:
    Claims (12)
    [0001]
    REVENDICATIONS1. A power electronics device, such as a frequency converter, which comprises power modules (30, REC1, REC2, CDC1, Cpc2, CDC5, INU1, INU21, INU22, INU51, INU52) and a substrate of power (41, 51), which power substrate (41, 51) comprises an elongated power supply circuit (1.1pc, DC +, DC-) arranged in the longitudinal direction of the power substrate, as well as first and second channels of elongate liquid cooling (45, 46, 53) arranged in the longitudinal direction of the power substrate, and which power modules (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) can be installed on the power substrate, characterized in that the power substrate (41, 51) is formed to be an elongated profile, the profile comprising a base portion (48, 58) and side walls (49, 59), which form a space which is open on one side, and in which at least two substructure locations and for power modules are arranged in the longitudinal direction of the power substrate (41, 51), which substrate locations are arranged at standardized distances (d4) from each other, such that each location has mechanical interfaces. (42, 55) substantially similar to the power substrate, electrical interfaces (44, 54) substantially similar to the power substrate supply circuit, and liquid cooling connections (43, 52) substantially similar to the power supply channels. liquid cooling of the power substrate.
    [0002]
    Power electronics device according to Claim 1, characterized in that liquid cooling channels (45, 46, 53) are formed inside the profile of the power substrate (41, 51) in such a way that the first edge of a wall of a liquid cooling channel (45, 46, 53) is connected to the base portion (48, 58) and the second edge to the side wall (49, 59), and wherein the liquid cooling connections (43, 52) are arranged such that the coolant is able to flow through a power module disposed on the power substrate to flow from the first liquid cooling channel (45) the second liquid cooling channel (46) when the power module also includes connections to the coolant (34).
    [0003]
    3. Power electronics device according to claim 1 or 2, characterized in that the power substrate is manufactured from an extrusion molded profile, the material being eg. aluminum, in which case the liquid cooling channels (45, 46, 53) belonging to the cooling arrangement are formed during the extrusion phase to form a fixed part of the power substrate (41, 51).
    [0004]
    Power electronics device according to one of the preceding claims, characterized in that the liquid cooling connections (43, 52) have a shape giving them compatibility so that a water-tight interface is provided. water is formed between a power module (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) and the power substrate (41, 51) when the power module is in place and fixed on the power substrate.
    [0005]
    Power electronics device according to claim 1 or 2, characterized in that the connections to the common supply circuit (DC +, DC-, 44, 54) have a shape giving them compatibility so that a current connection is formed between a power module (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) and the power substrate (41, 51) when the power module is in place and attached to the power substrate.
    [0006]
    6. power electronics device according to any one of the preceding claims, characterized in that the power substrate (41, 51) is substantially U-shaped in its cross section.
    [0007]
    7. Power electronics device according to any one of the preceding claims, characterized in that some or all of the power modules belonging to the same power substrate (41, 51) are able to be connected in parallel to the same external load.
    [0008]
    Power electronics device according to one of the preceding claims, characterized in that a power module (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) is installed in an enclosure (31) made of an electrically insulating material.
    [0009]
    Power electronics device according to one of the preceding claims, characterized in that the connections of a power module (30, REC1, REC2, CDC1, CDC2, CDC5, INU1, INU21, INU22, INU51, INU52) at the first electrical circuit are placed on the base part (33) of the power module. 302 74 83 10
    [0010]
    10. Power electronics device according to any one of the preceding claims, characterized in that a power module (INUi, INU21, INU22, INU51, INU52) comprises connections to a second electrical circuit and in that the Connections (U, V, W) are placed on the cover portion (36) of the power module.
    [0011]
    11. power electronics device according to any one of the preceding claims, characterized in that, in a type of power module which does not include an interface with a liquid cooling, an impermeable surface is installed on the part of the power module which faces the coolant connections of the power substrate when the power module is put in place, said surface being eg. a flexible rubber-like closed surface which prevents leakage of liquid through the liquid cooling connections (43, 52). 15
    [0012]
    Power electronics device according to one of the preceding claims, characterized in that the supply circuit (1.1pc, DC +, DC-) extends in the longitudinal direction essentially from one end to the other. other of the power substrate (41, 51).
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